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ME 196R

CONTENT

Chapter 1 Overview of Microsystems

1.1 What is a Microsystem.

1.2 Evolution of Microfabrication.

1.3 Microsystems and Microelectronics

1.4 Microsystems and Miniaturization.

1.5 Applications of Microsystems

1.5.1 Application in automotive industry

1.5.2 Application in healthcare industry

1.5.3 Application in aerospace industry

1.5.4 Application in industrial products

1.5.5 Application in consumer products

1.5.6 Application in telecommunication

1.6 Markets for Microsystems.

Chapter 2 Working Principles for Common Microsystems

2.1 Elements of Microsystems

2.2 Micro Sensors

2.3 Micro Accelerometers

2.4 Micro Actuators and Motors

2.4.1 Actuation by electrostatic forces

2.4.2 Actuation by piezoelectricity

2.4.3 Actuation by thermal force and shape memory alloys

2.4.4 Micro motors

2.5 Other Micro Devices

2.5.1 Micro valves

2.5.2 Micro pumps

2.5.3 Micro springs, grippers and robots

2.6 Micro Fluidics

2.7 Optoelectronics Sensors and Actuators

Chapter 3 Engineering Mechanics for Microsystems Design

3.1 Why Engineering Mechanics

3.2 Static Bending of Thin Plates

3.2.1 General formulations

3.2.2 Bending of circular plates with edges fixed

3.2.3 Bending of rectangular plates with edges fixed

3.2.4 Bending of square plates with edges fixed

3.3 Mechanical Vibration

3.3.1 General formulation

3.3.2 The resonant vibration

3.3.3 Micro accelerometers

3.3.4 Resonant micro sensors

3.4 Thermomechanics

3.4.1 Thermal effects on mechanical strength of materials

3.4.2 Creep deformation

3.4.3 Thermal stresses

3.5 Fracture Mechanics

3.5.1 The stress intensity factor

3.5.2 The fracture toughness

3.5.3 Interface fracture

3.6 Fluid Mechanics

3.6.1 Fluid dynamics

3.6.2 The capillary effects

3.7 The Finite Element Method for Stress Analysis

Chapter 4 Engineering Physics for Microsystems Design

4.1 Introduction

4.2 Atomic Structure of Matters

4.3 Plasma Physics

4.4 Quantum Electronics

4.5 Physical Chemistry

4.6 Electrochemical Reactions

4.7 Electrostatic Systems

4.7.1 The Coulomb’s law

4.7.2 Electrostatic forces in parallel plates

4.7.3 Design of micro electrostatic motors

Chapter 5 Scaling Laws in Miniaturization

5.1 Introduction to Scaling

5.2 Scaling in Solid Mechanics

5.2.1 Scaling in volumes and surfaces

5.2.2 Scaling in dynamic forces

5.2.3 The Trimmer force scaling vector

5.2.4 Scaling in electrostatic forces

5.2.5 Scaling in electromagnetic forces

5.3 Scaling in Fluid Mechanics

5.4 Scaling in Heat Transfer

5.4.1 General principle of heat conduction

5.4.2 Fourier law of heat conduction

5.4.3 The heat conduction equation

5.4.4 Newton’s cooling law

5.4.5 Solid-fluid interaction

5.4.6 Scaling in conductive heat transfer

5.4.7 Scaling in convective heat transfer

Chapter 6 Materials for MEMS and Microsystems

6.1 Introduction

6.2 Substrates and Wafers

6.3 Active Substrate Materials

6.4 Silicon as a Substrate Material

6.4.1 Ideal substrate for MEMS

6.4.2 Single silicon crystals and wafers

6.4.3 Crystal structure

6.4.4 The Miller indices

6.4.5 Mechanical properties of silicon

6.5 Silicon Compounds

6.5.1 Silicon dioxide

6.5.2 Silicon carbide

6.5.3 Silicon nitride

6.5.4 Polycrystalline silicon

6.6 Silicon Piezoresistors

6.7 Piezoelectrics

6.8 Gallium Arsenide

6.9 Quartz

6.10 Packaging Materials

Chapter 7 Overview on Microsystems Fabrication Processes

7.1 Introduction

7.2 Ion implantation

7.3 Diffusion

7.4 Photolithography

7.4.1 Overview

7.4.2 Photoresists and application

7.4.3 Light sources

7.4.4 Resist development

7.4.5 Resist removal and post baking

7.5 Oxidation

7.5.1 Thermal oxidation

7.5.2 Silicon dioxide

7.5.3 Thermal oxidation rates

7.6 Deposition

7.6.1 Working principle of CVD

7.6.2 Chemical reactions in CVD

7.6.3 Rat of deposition

7.6.4 Enhanced CVD

7.7 Sputtering

7.8 Etching

7.8.1 Chemical etching

7.8.2 Plasma etching

Chapter 8 Overview on Micro Manufacturing

8.1 Introduction

8.2 Bulk Manufacturing

8.2.1 Overview on etching

8.2.2 Isotropic and anisotropic etching

8.2.3 Wet etchants

8.2.4 Etch stop

8.2.5 Dry etching

8.2.6 Comparison of wet vs. dry etching

8.3 Surface Micromachining

8.3.1 General description

8.3.2 Process in general

8.3.3 Mechanical problems associated with surface micromachining

8.4 The LIGA Process

8.4.1 General description of the LIGA process

8.4.2 Materials for substrates and photo resists

8.4.3 Electroplating

8.4.4 The SLIGA process

8.5 Summary on Micromachining

8.5.1 Bulk micromachining

8.5.2 Surface micromachining

8.5.3 The LIGA process

Chapter 9 Mechanical Design of Micro Devices

9.1 Introduction

9.2 Design Considerations for MEMS

9.2.1 Design constraints

9.2.2 Selection of materials

9.2.3 Selection of manufacturing processes

9.2.4 Selection of signal transduction

9.2.5 Electromechanical systems

9.2.6 Packaging

9.3 Process Design

9.3.1 Photolithography

9.3.2 Thin film fabrications

9.3.3 Subtractive processes

9.4 Mechanical Design

9.4.1 Thermomechanical loading

9.4.2 Thermomechanical stress analysis

9.4.3 Dynamic analysis

9.5 Mechanical Design Using Finite Element Method

9.5.1 Basic formulation

9.5.2 Simulation of microfabrication processes

9.6 Design of Silicon Die of a Micro Pressure Sensor

9.7 Computer-Aided Design

9.7.1 Why CAD?

9.7.2 What is in CAD?

9.7.3 How to choose a CAD package?

Chapter 10 Mechanical Packaging of Micro Devices

10.1 Introduction

10.2 Overview on Microelectronics Packaging

10.3 Overview on Microsystems Packaging

10.4 Microsystems Packaging

10.4.1 Die level packaging

10.4.2 Wire bond

10.4.3 Die protection

10.4.4 Device level packaging

10.4.5 System level packaging

10.5 Selection of Packaging Materials

10.6 Signal Transduction

10.6.1 Typical electrical signals in microsystems

10.6.2 Measurements of resistance

10.6.3 Signal transduction in pressure sensors

10.6.4 Capacitance measurements.

Chapter 11 Future Trend in Miniaturization-an overview of nano-technology

Bibliography

 

This web page is under the supervision of Dr. Buff Furman. He can be reached at bjfurman@email.sjsu.edu or by phone at (408) 924-3817. This page was last updated on 03AUG99.