Dr. Hsu

Dr. Tai-Ran Hsu
Professor

Department of Mechanical & Aerospace Engineering
San Josť State University
One Washington Square
San Josť, California 95192-0087

Office: Engineering 117B
Telephone: (408) 924-3905
Fax: (408) 924-3995
E-mail: tairan@email.sjsu.edu



Biography

Dr. Tai-Ran Hsu
Professor
Mechanical & Aerospace Engineering Department
Fellow of American Society of Mechanical Engineers

1959 B.S., National Cheng Kung University, Taiwan, China
1963 M.S., University of New Brunswick, Fredericton, NB, Canada
1968 Ph.D., McGill University, Montreal, Quebec, Canada


Dr. Hsu teaches dynamics, engineering analysis, senior design projects, and microsystems design, manufacture and packaging. His research interest is in the application of thermomechanics in MEMS design and packaging, and nano scale engineering. He has published 5 books and edited 2 others in finite element methods, CAD, and MEMS as well as over 120 technical papers through peer review systems.  He has served as a department Chair in both Canada and USA for 12 years.  He was invited to deliver keynote speeches on miniaturization technologies, i.e. micro and nano technologies and micromechatronics at numerous international conferences and symposia in USA and abroad.

 

Courses Taught:

Computer-Aided Design, Machine Design, Finite Element Analysis, Strength of Materials, Mechanical Engineering Analysis, Engineering Mechanics, Microsystems Design and Manufacture.

ME 195 - Senior Project Course Manual
ME 195 Senior Projects for 2009-10
ME 130 Applied Engineering Analysis - Syllabus
ME 130 - Answers to Homework Problems
ME 130 - Ch. 1 - Overview, Ch. 2 - Math Modeling, Ch. 3 - First Order DEs, Ch. 4 - Second Order DEs, Ch. 5 - Laplace Transform, Ch. 6 - Fourier Series, Ch. 7 Intro to PDE, Ch.8- Matrices, Ch. 9 - Intro FDM, Ch. 10 - Intro to Statistics, Review for Final, Greensheet (S14)

ME 189 Microsystems Design and Packaging
ME 189 - Greensheet
ME 189 - Ch. 1, Ch. 2, Ch. 3, Ch. 4, Ch. 5, Ch. 6, Ch. 7, Ch. 8, Ch. 9, Ch. 10, Ch. 11, Ch. 12, Ch.2 Supplement on Solar

Recent Presentations:

Lecture Notes on Nanoscale Heat Transfer
Presentation on Solar Photovoltaic
Infrastructure Support & HR Development for Solar PV Industry

Energy, Environment and Social Impacts (October 2009)
Micromechatronics - A vital industrial technology in the new century (March 2009)
Tutorial on Solar PV
Globalization - New Global Economy and Social Impacts, and Impacts After the Storm

Tutorial on Wind Power

 

MS Thesis Supervised in Last Six Years:

  • "Numerical Simulation on the Fatigue Life Model of Ball Grid Array Solder Joints,"
    MS thesis by Sreevani Abbaraju, December 2004.
  • "Optimal thermal Conditions for Anodic Bonding of Microsystems,"
    MS thesis by Say Wei Low, May 2004
  • "Thermal Efects on Anaodic Bonding in MEMS Packaging," MS thesis, Say Wei Low,  
    December 2003.
  • "Impact to Dispersion and Variance of Species in Microflows Turns," MS thesis, Sean 
    Matheson, August 2003.
  • "Size Effects on Fracture Toughness of Plastic Molding Compounds," MS thesis, Chung-
    Chun Tseng, December 2002.
  • "A Comparative Study on Actuation Methods in Microvaalve Design," MS thesis, Yen
    Chang Hu, August 2002.
  • "On Micro Sensing Technology," Research Project by Arif Halim, September 2000.
  • "On Design of Micro bearings," MS thesis by Peter Baum, September 2000.
  • "Theory, Design, Manufacturing and Packaging of Micro Accelerometers," MS thesis by  Loay Elmorsy, December 2000.

 

Experience in Research

Dr. Hsu's experience in R&D is primarily in the application of advanced technologies to industry. The scope of his R&D experience and efforts involves the following areas:

  1. Mechanical and thermal design of large steam generating plants.
  2. Application of finite element method in simulating thermomechanical behavior of: mechanical engineering systems, such as nuclear reactor fuel systems; design of structures made of brittle materials for high temperature applications; low-cycle fatigue involving creep-fracture of materials; and simulations of in-situ coal gasification and bitumen extraction of oil sands.
  3. Modeling and simulations of nuclear reactor fuel elements under normal operating and loss of coolant accident (LOCA) conditions.
  4. Precision measurements of deformation of structures at elevated temperature using laser holographic interferometry techniques.
  5. Dynamic property measurements using Split-Hopkinson Bars.
  6. Flexible manufacturing systems in industrial automation.
  7. Reliability of microelectronics at chip and board levels.

He has received research grants and contracts exceeds $3.5 million from granting agencies from Natural Sciences and Engineering Research Council (NSERC) and National Science Foundation (NSF) of the governments of Canada and USA respectively, and also from industries such as Atomic Energy of Canada Ltd, Alberta Oil Sands Technology Research Authority, Industrial Technology Research Institute, Optimal Corporation, FloWind Corporation, Flextronics, etc. 

Dr. Hsu's current research covers three related areas of (1) Microelectromechanical system (MEMS) and micromechantronics design and packaging; (2) Microelectronics packaging at chip and board levels; (3) Nano scale engineering.

Topics included in Dr. Hsu's current research in MEMS and micromechatronic systems design and packaging include: electromechanical design; residual stress and strains induced by microfabrication processes; interfacial fracture of micro device components; CAD for MEMS and microsystems assembly; and packaging of micro devices.

Currently, Dr. Hsu serves as Co-principal Investigator in two funded research projects by National Science Foundation (NSF). These are: (1) Development of laboratory curriculum devoted to the thermal management of electronics (PI: Professor Nicole Okamoto), and (2) Interdisciplinary & flexible laboratory experiments in micro-electro-mechanical systems (PI: Professor John Lee).

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International Professional Experience

  • KP Chao High Tech Chair Professor, Zhejiang University, Hangzhou, China,
    June 1, 2007 - May 31, 2010
  • Senior Adviser, Microsystems technology, Industrial Technology Research Institute (ITRI) - International, San Jose, California, USA (2001-present)
  • Advisor, Mechanical Industrial Research Laboratories, Industrial Technology Research Institute (ITRI), Taiwan (1999-present)
  • Tutorial lectures on "Microsystems Design, Manufacture and Packaging Technology," Industrial Technology Research Institute, Hsinchu, Taiwan, January 7-9, 2002 (attended by 170 plus engineers and scientists from Taiwan industry, government laboratories and universities).
  • Tutorial lectures on "Microsystems Technology," Ngee Ann Polytechnic of Singapore, June 18-23, 2001 (attended by 45 faculty members).

  • Founder and Chair, "Trans-Pacific Workshop on Mechatronics Technology" This first Workshop was convened in San Jose, California, September 15-18, 1996.  Subsequent conferences were held annually in turn in Japan, Taiwan, Singapore and Korea.
  • Specialist on a mission to assist Romanian government in nuclear fuel design and testing by the International Atomic Energy Agency (IAEA) of the United Nations, Petiti, Romania, July-September 1992.
  • Member of Canadian delegation on nuclear reactor technology in Oslo, Norway organized by OECD of the United Nations in September, 1985.

 

Selected Presentations

Part A: Invited Speeches at International Conferences and Symposia:

  • Keynote lecture on "Micromechatronics- A vital technology for industrialized nations in the new century," 2nd Congreso de Mecatronica, San Luis Potosi, Mexico, August 27, 2005.
  • Keynote Speech on "Micro Assembly-A technology on the frontier of industrial automation," 8th International conference on Automation Technology, Taichung, Taiwan, May 5, 2005.
  • Hsu, T.R. "Micromechatronics-a core technology in industrial revolution in miniaturization," invited lecture at the International Congress on Mechatronics, San Luis Potosi, Mexico, March 4, 2005.
  • Invited lecture on "On the Integration of Micro and Nano Scale Engineering," 20th Modern Engineering and Technology Seminars, Taipei, Taiwan, November 15, 2004.
  • Keynote lecture on "Micro and Nano Scale Engineering-Design, Fabrication and Packaging," 6th CASPA Workshop on Equipment and Processes, Hsinchu, Taiwan, September 7, 2004.
  • Keynote lecture on "Miniaturization-a paradigm shift in advanced manufacturing and education," '2002 International Conference on Advanced Manufacturing and Education for the 21st Century', Chia-yi, Taiwan, August 12-15, 2002
  • Plenary lectures on "MEMS and Microsystems Technology-the present and future," Nee Ann Polytechnic, Singapore, June 22, 2001.
  • Plenary lecture on "Mechanical engineering-"20/20" and Beyond," University Saskatchewan, Saskatoon, Canada, March 26, 2001.

Part B: Other Presentations on Micro Systems Technology:

  • Invited tutorial paper on "Introduction to Reliability in MEMS Packaging," International Symposium for Testing and Failure Analysis, San Jose, California, November 5, 2007
  • Invited paper on "Reliability in MEMS Packaging," International Reliability Physics Symposium, San Jose, California, March 26-30, 2006.
  • "Micro and Nano Scale Engineering-challenge and opportunity," at Silicon Valley Engineering Council, March 23, 2005
  • "Packaging of Microelectronics and MEMS," IMAPS Northern California Chapter luncheon, June 2, 2004.
  • "MEMS Design and Packaging-issues and resolutions," Chinese Institute of Engineering, San Francisco Chapter, November 7, 2003.
  • "Miniaturization-A leading technology of the 21st century," 'Leading Technologies', San Jose State University, September 26, 2002.
  • Invited lecture on "An Overview of Microsystems Design and Packaging," 2002 MEMS & Network Security Symposium, North American Taiwanese Engineers' Association, San Jose, California, September 6, 2002.
  • Invited paper on "Mechanical Engineering Design for MEMS and Microsystems," at PhoPack 2002, Palo Alto, California, July 16, 2002.
  • "An Overview of MEMS and Microsystems packaging," IEEE CPMT/Santa Clara Valley Section luncheon, June 12, 2002.
  • "Mechanical Engineering Design for MEMS and Microsystems," ASME International, Santa Clara Valley Section luncheon, March 21, 2002.
  • "An Overview of MEMS and Microsystems Packaging," Ioλon, Inc., San Jose, August 17, 2001.

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Publications in the last 10 years

Summary on total number of publications:

Books published:   8  (6 authored, 2 edited)
Papers published in peer-reviewed systems:   121
Papers delivered at technical conferences:       61

Books:

"MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering,"
2nd Edition. John Wiley & Sons, Inc., Hoboken, NJ, 2008 (ISBN 978-0-470-08301-7)

"MEMS Packaging," Institute of Electrical Engineers, London, U.K. 2004 (ISBN 0-86341-335-8)
"MEMS and Microsystems: Design and Manufacture," McGraw-Hill, Boston, 2002 (ISBN 0-07-239391-2)

Papers Published in Peer Review Systems:

1.      Hsu, T.R., "MEMS Demand New Package Designs," Semiconductor International, April 2001.

2.      Hsu, T.R., "Teaching ME Undergraduates in MEMS Design and Manufacture", DE-10A, ASME IMECE 2000, Orlando, Florida, November  2000.       

3.   Hsu, T.R., "Packaging Design of Microsystems and Meso-Scale Devices", IEEE Transactions on CPMT-B: Advanced Packaging, Vol. 23, No. 4, November 2000.

4.      Hsu, T.R. and Nguyen, L.T., "On the Use of Fracture Mechanics in Plastic-Encapsulated Microcircuits Packaging", Proceedings of ASME International Mechanical Engineering Congress, 11th Symposium on Mechanics of Surface Mount Assemblies, Nashville, TN, November 1999, pp. 1-8.

5.      Hsu, T.R., "Development of an Undergraduate Curriculum in Mechatronics Systems Engineering", Journal of Engineering Education, April 1999, pp. 173-179.

6.      Hsu, T.R. and Wang, J. "A Mechatronics Curriculum Stem for Undergraduate Mechanical Engineering Education", 1999 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM'99), Atlanta, GA, September 19-22, 1999.

7.      Hsu, T.R., and Sun, N., "Residual Stresses/Strains Analysis of MEMS," Modeling and Simulation of Microsystems, Semiconductors, Sensors and Actuators, Santa Clara, California, April 6-8, 1998, pp. 82-87.

8.      Wang, J., Hsu, T.R. and Ibrahim, N., "Advanced Mechatronics Systems Design Courses for Undergraduate Curriculum", Paper 98-WA/DE-20, ASME International Mechanical Engineering Congress and Exposition, Anaheim, CA, No. 15-19, 1998.

9.      Hsu, T.R. "Mechatronics in Manufacturing", a contributing part of CRC Mechanical Engineering Handbook, ed. by F. Kreith, February 1998.

10.  Nguyen, L.T., Hsu, T.R. and Kuo, A.Y. "Interfacial Fracture Toughness in Plastic Packages", 'Application of Fracture Mechanics in Electronic Packaging', AMD-Vol 222/EEP-Vol 20, ASME, 1997, pp. 15-24.

11.  Hsu, T.R., Fawzi, K.M., Nguyen, L.T. and Kuo, A.Y., "Fracture Strength of Epoxy Molding Compounds", Advances in Electronic Packaging 1997, Vol. 1, ASME, 1997, pp. 261-267.  

12.  Hsu, T.R. "Mechatronics-An Overview", IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part C, Vol. 20, No. 1, 1997 (Guest edited by T.R. Hsu),
pp. 4-7.    

13.  Sun, N.S. and Hsu, T.R., "Thermomechanical Coupling Effects on Fractured Solids", International Journal of Fracture, Vol 78, 1996, pp. 67-87.

14.  Hsu, T.R. "Undergraduate Curriculum Development in Mechatronic Systems Engineering", Proc. Of the 1996 Annual Meeting of Accreditation Board for Engineering and Technology, October 31, 1996, San Diego, CA

15.  Furman, B.J., Hsu, T.R., Barez, F., Tesfaye, A., Wang, J., Hsu, P. and Reischl, P., "Laboratory Development for Mechatronics Education", Proc. of 1996 ASEE Annual Conference, Washington, DC, June 27, 1996.

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Selected Industrial Technology Research and Consulting Services

1.  "Feasibility of Development of Smart Hearing Aids," for Industrial Technology Research          
       Institute-International, San Jose, California, May-October 2003.

2.  "Design of Contactless Energy Transfer Micro Module," for Industrial Technology Research      
       Institute, Taiwan , December 2003.

3.  "Moisture induced failure in plastic encapsulated microcircuits," with Optimal Inc., San Jose
      and National Semiconductor, Santa Clara, California for US Air Force,  1994-1995.

4.  "Fatigue Life of PCB subjected to Bending Loads," A graduate project for Flextronics, San

       Jose, California, May - October, 2003.

5.  "Design of a retrofit scrubber for semiconductor testing probes," a senior project for Electroglas,
       Inc., San Jose , CA , 1997.

6.  "Low Noise Air Fan/Filter Design," a senior project for Servicor, Inc., San Carlos , CA , 1995.

7.  "Polymer Design enhancement of Temporary Cleanroom Enclosure Modules," a senior project  
       for Servicor, Inc., San Carlos , CA , 1995

8.  "Design and Construction of a Tilt Garden Cart," a senior project for Gibson & Son 

      Manufacturing Company, East Palo Alto , CA under a sponsorship of NIST/California

      Manufacturing Technology Center, Torrance , CA , 1995.

 

 

Selected Reprints of Recent Publications

"Introduction to Reliability in MEMS Packaging," International Symposium for Testing & Failure Analysis, San Jose, CA, November 5, 2007

"Reliability in MEMS Packaging," an invited paper delivered at 44th IEEE International Reliability Physics Symposium, San Jose, CA., March 26-30, 2006.

"Micro Assembly - a technology on the frontier of new industrial automation," a keynote lecture delivered at the 8th International Conference on Automation Technology, Taichung, Taiwan, May 5, 2005.

"Micromechatronics - the core technology of industrial revolution in miniaturization," a plenary lecture delivered at the International Congress on Mechatronics, San Luis Potosi, Mexico,
March 4, 2005.

"On the Integration of Micro and Nano Scale Engineering," a plenary lecture delivered at the 20th Modern Engineering and Technology Seminars, Taipei, Taiwan, November 15, 2004.

"Miniaturization - a paradigm shift in advanced manufacturing and education," a plenary lecture delivered at the 2002 IEEE/ASME International Conference on Advanced Manufacturing Technologies and Education in the 21st Century, Chia-Yi, Taiwan, August 10-15, 2002.
 

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