Department of
Director, Engineering & Design and Thermal Architect
Technology Leadership Group
Flextronics
Telephone: (408) 576-6765
E-mail: yshabany@yahoo.com
ME109: Heat Transfer in Electronics
ME211: Advanced Heat Transfer
ME230: Advanced Mechanical Engineering Analysis
Flextronics
International, Corporate Technology Group,
·
Led thermal
architecture, design and technology development activities across multiple
segments and business units
·
Led
thermal engineers in Flextronics’ worldwide sites on their thermal design
activities
·
Worked with
product managers and their cross-functional engineering teams on a variety of
infrastructure, consumer, automobile, medical and power electronic ODM and CDM
products
·
Was
responsible for leading design teams towards feasible thermal/mechanical
solutions for high power density electronic equipment
·
Evaluated
new thermal management technologies and their potential applications in
electronic equipment
·
Established
an advanced airflow and thermal test lab for Flextronics Corporate Technology
Group
Applied Thermal
Technologies,
· Consulted with upper management and prepared business plans and annual budgets
· Managed teams of local and remote engineers in their thermal design efforts
· Worked with engineering managers in over 25 companies to design appropriate cooling solutions for their products within the electrical, mechanical, industrial design and environmental limitations
· Collaborated with mechanical and industrial design firms to provide integrated thermal/mechanical solutions to common clients
· Prepared and taught short courses and workshops on thermal management of electronics
· Worked in multi-discipline engineering teams in over 35 companies as the engineer responsible for thermal design of their products
· Performed system-level, board-level and package-level thermal analyses using appropriate combination of analytical techniques, experimental methods and numerical tools
· Designed cooling solutions for over 50 products including telecom and networking equipment, desktop and laptop computers, biomedical equipment, and consumer products
· Interacted with electrical and mechanical engineers in semiconductor companies to understand thermal characteristics of their devices
· Interacted with suppliers of thermal management products (heat sink, heat pipe, fan, thermal interface material, etc.) to come up with the best thermal solutions using off-the-shelf or custom products
Department of
Mechanical Engineering,
· Developed a method for solving linear matrix equations
· Developed an algebraic stress model to predict temperature and heat transfer in turbulent flows
· Modified a Computational Fluid Dynamics code to include this model and used the code to study the accuracy of the model predictions in turbulent boundary layers and channel flows
Department of
Mechanical Engineering, UBC
· Developed a two-dimensional Computational Fluid Dynamics code to study the effects of gas absorptivity and emissivity on heat transfer in a turbulent natural convection boundary layer
Sazeh Consultant
Engineers,
· Worked with a team of mechanical, electrical, chemical and structural engineers to design a natural gas injection plant
· Prepared specifications and data sheets for turbomachinery equipment including gas turbines and compressors needed for the plant, analyzed the performance of the equipment from different vendors, and selected the best equipment
Iran Radiator
Company, Tehran, Iran
· Designed and built a small wind tunnel
·
Y. Shabany, “Radiation Heat Transfer from
Plate-Fin Heat Sinks”, Proceedings of 24th IEEE Semi-Therm
Symposium, March 16 – 20, 2008,
·
Y. Shabany, “A Novel Airflow Management System
with Redundant Fan Field Replaceable Units”, Proceedings of IPACK2007,
July 8 – 12, 2007,
·
Y. Shabany, “A PCM-Filled Heat Sink for an
LED-Based Dental Device”, Proceedings of IPACK2007, July 8 – 12,
2007,
· Y. Shabany, “High-Level Packaging Options for Outdoor Remote Units”, Proceedings of 23rd IEEE Semi-Therm Symposium, March 2007.
·
N. Sadeghi, F. Barez and Y. Shabany, “A
New Approach to Model Axial Fans in Commercial CFD Tools”, Proceedings of
IPACK2005, July 17 – 22, 2005,
·
·
Y. Shabany, “Effects of Boundary
Conditions and Source Dimensions on the Effective Thermal Conductivity of a
Printed Circuit Board”, Proceedings of IPACK03, July 6 – 11, 2003,
·
B. Puranik and Y. Shabany, “Optimum
Airflow Management for Multi-Board Rack-Mount Equipment”, Proceedings of
IPACK03, July 6 – 11, 2003,
·
M. K. Berhe and Y. Shabany, “The
Effectiveness of Solar Shield for Outdoor Equipment” Proceedings of
IPACK03, July 6 – 11, 2003,
· Y. Shabany, ``Component Size and Effective Thermal Conductivity of Printed Circuit Boards'', ITherm 2002, May 29 - June 1, 2002
·
Y. Shabany and P. A. Durbin, ``Applications of a
Well-Posed Model for the Turbulent Diffusivity Tensor'', 1999 ASME/JSME Fluids Engineering
Division Summer Meeting, July 18-23, 1999,
· M. Behnia, S. Parneix, Y. Shabany, P. A. Durbin, ``Numerical Study of Turbulent Heat Transfer in Confined and Unconfined Impinging Jets'', Int. J. Heat and Fluid Flow. Vol. 20, No. 1, February 1999, pp. 1-9.
· P. A. Durbin, Y. Shabany, S. Parneix and M. Behnia, ``Connection of Lagrangian Dispersion Theory to Heat Transfer", 2nd International Symposium on Turbulence, Heat and Mass Transfer, K. Hanjalic and T. W. J. Peeters (Editors), Delft University Press, 1997, pp. 47-54.
· Y. Shabany and P. A. Durbin, ``On Explicit Algebraic Scalar Flux Approximation'', AIAA Journal, Vol. 35, No. 6, June 1997, pp. 985-989.
· P. Durbin and Y. Shabany, ``Toward Consistent Formulation of Reynolds Stress and Scalar Flux Closures'', Fluid Dynamics Research, Vol. 20, 1997, pp. 115-125.
· Y. Shabany, M. Iqbal and E. G. Hauptmann, ``Turbulent Natural Convection Boundary Layers in an Absorbing and Emitting Gas'' , HTD-Vol. 318, Heat Transfer in Turbulent Flows ASME 1995, pp. 21-27.