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Topic: Thermal Management
- Rhee, J., Hernandez, S. I., "Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Sta," ASME J. Electronics Packaging, (2006), Vol. 128, No. 4, 484-493.
- Braun, F. D., Parent, D. W., Papalias, T. A., "On-chip temperature control circuit using common devices," Proceedings of the Custom IC conference, (September 18-21, 2005). 215-218.
- Rhee, J., Moffat, R.J., "Experimental Estimate of the Continuous One-Dimensional Kernel Function in a Rectangular Duct with Forced Convection," ASME J. Heat Transfer, (2006), Vol. 128, No. 8, 811-818.
- Bhave, N., Okamoto, N.C., "Modeling Non-Coplanarity Effects on Thermal Design of Computer Chips," IEEE Advanced Packaging Materials Symposium, San Jose, Ca, (October 3-5, 2007).
- Heresztyn, A.J.H., DeJong Okamoto, N.C., "Thermal Design of Microchannel Heat Sinks for Low-Orbit Micro-Satellites," Proceedings of the 3rd International Conference on Microchannels and Minichannels, American Society of Mechanical Engineers, Toronto, Canada, (June 12-15, 2005).