ME 146 Thermal Management of Electronics
Administration
Syllabus
Schedule
Report Format
Course Reader Contents
Other Resources
Overview of Nanoscale Heat Transfer, by Dr. Tai-Ran Hsu
Download EES -- You'll need a password from your instructor to unzip this. Only SJSU students and faculty may download this file.
A list of some common acronyms. Let me know if there are any you'd like me to add!
Jedec -- standards for the solid state industry, including thermal management standards
Electronics Cooling Magazine -- trade journal with practical electronics cooling articles and advertising. Subscribe for free!
Powerpoint Presentations
Why Thermal Management?
Overview of Temperature Measurement
Fan Performance
Where is Heat Generated?
Heat Sink Selection
Thermal Interface Materials
Constriction and Spreading Resistance
Simplified Thermal Stress Analysis
Liquid Cooling of Electronics
Lead-Free Electronics
Jedec Standards
Heat Pipes
Thermoelectric Coolers
Vapor Compression Systems
Lab/Activity Materials
Thermocouple Construction and Calibration
Fan Performance and Chassis Impedance Wind Tunnel CFM plots Lab Data
Computer Chassis Cooling
Project Specifications
Flotherm Tutorial version 1
Flotherm Project
Heat Sink Performance Testing Added June 2007
Heat Pipes Part 1 EES Code for orifice plate
Heat Pipes Part 2 (Laptop Cooling)
Thermoelectric Cooling Added June 2007
Homework
Homework 1 Overview of Thermal Resistance Method Solution part a Solution part b (solving for Tj)
Homework 2 Calculating Heat Sink Flow Bypass Solution
Homework 3 Heat Sink Performance Solution
Homework 4 Constriction/Spreading Resistance Solution
Homework 5 Thermal Stress Analysis Solution Bottom number on solution that is cut off is 1.66 x 104 psi
Homework 6 Natural Convection/Radiation Solution
Homework 7 Forced Convection Solution
Homework 8 Liquid Flow in Microchannels Solution
Homework 9 Boiling Heat Transfer Solution
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