Recent project partners include Hewlett Packard, Cisco Systems, Apple Computer, Therma, Inc., Lockheed Martin, and the National Science Foundation.
AMCA 210-99 Airflow Test Chamber Low-Speed Wind Tunnel
Airflow Test Chamber for Component-Level Testing
High Altitude Chamber
Shown below are recent publications by the lab directors Drs. Rhee and Okamoto (DeJong) with their students and colleagues related to the work of the laboratory.
Journal Publications Related to the Cooling of Electronics
Okamoto, N.C., Hsu, T-R, and Bash, C., 2009, "A Thermal Management of Electronics Course and Laboratory for Undergraduates," Advances in Engineering Education, Vol. 1, No. 3.
Rhee, J., and Bhatt, A., 2007, “Spatial and Temporal Resolution of Conjugate Conduction-Convection Thermal Resistance,” IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, pp. 673-682
Rhee, J., and Hernandez, S.I., 2006, “Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards,” ASME J. Electronics Packaging, Vol. 128, No. 4, pp. 484-493.
Rhee, J., and Moffat, R.J., 2006, "Experimental Estimate of the Continuous One-Dimensional Kernel Function in a Rectangular Duct With Forced Convection, Journal Heat Transfer, Vol. 128, No. 8, pp. 811-818.
DeJong, N.C., and A.M. Jacobi, 2003, “Heat Transfer and Pressure Drop for Flow through Bounded Louvered-Fin Arrays,” Experimental Thermal and Fluid Science, Vol. 27, pp. 237-250.
DeJong, N.C., and A.M. Jacobi, 2003, “Localized Flow and Heat Transfer Interactions in Louvered-Fin Arrays,” International Journal of Heat and Mass Transfer, Vol. 46, pp. 443-455.
Rhee, J., and Azar, K., 1999, “Adjusting Temperature Data for High Altitude” Electronics Cooling Magazine, September, Vol. 5, No. 3. Online version.
DeJong, N.C., and A.M. Jacobi, 1999, “Local Flow Structures and Heat Transfer in Convex-Louver Fin Arrays,” Journal of Heat Transfer, Vol. 121, pp. 136-141.
DeJong, N.C., L.W. Zhang, A.M. Jacobi, S. Balachandar, and D.K. Tafti, 1998, “A Complementary Experimental and Numerical Study of the Flow and Heat Transfer in Offset Strip-Fin Heat Exchangers,” Journal of Heat Transfer, Vol. 120, pp. 690-698.
DeJong, N.C., and A.M. Jacobi, 1997, “An Experimental Study of Flow and Heat Transfer in Parallel-Plate Arrays: Local, Row-by-Row and Surface Average Behavior,” International Journal of Heat and Mass Transfer, Vol. 40, pp.1365-1378.
DeJong, N.C., M.C. Gentry, and A.M. Jacobi, 1997, “An Entropy-Based, Air-Side Heat Exchanger Performance Evaluation Method: Application to a Condenser,” International Journal of HVAC&R Research, Vol. 3(3), pp. 185-195.
Conference Proceedings Related to the Cooling of Electronics
Nagendrappa, N., Okamoto, N.C., and Barez, F., 2010 "Thermal Characterization of Fan-in Package-on-Packages," accepted for Semi-Therm 26, Santa Clara, CA.
Meakins, M., Okamoto, N.C., and Bash, C., 2009, "An Energy and Exergy Analysis of Economizer-Based Data Centers, " Proceedings of the ASME International Energy Sustainability Conference, San Francisco, CA.
Singh, S., and Okamoto, N.C., 2009, "Optimal Micro Heat Pipe Configuration for High Performance Heat Spreaders, " IMAPS Workshop on Thermal Management, Palo Alto, CA.
Kam, P.C., Coppage, A.G., Kam, C.C., Shafian, S., Chun, B., and
Rhee, J., 2008, "Lead-free, Fluxless Solder Joints to Synthetic Diamond,"
Proceedings of the 2008 ASME
International Mechanical Engineering Congress and
Exposition, Oct. 31-Nov.6, Boston, MA
Rogacs, A., and Rhee, J., 2007, "Performance – Cost Optimization
of a Diamond Heat Spreader,” Proceedings of 2007 IEEE CPMT Division,
Advanced Packaging Materials Conference, San Jose, CA, Oct. 3-5
Rhee, J., 2006, "The Role of Temperature Superposition in Thermal
Management," Proceedings of the 11th IEEE CPMT Advanced Packaging Materials
Conference, Atlanta, GA
Heresztyn, A.J.H., and DeJong Okamoto, N.C., 2005, "Thermal Design of Microchannel Heat Sinks for Low-Orbit Micro-Satellites," Proceedings of the 3rd International Conference on Microchannels and Minichannels, American Society of Mechanical Engineers, Toronto.
Rhee, J., and Wong, G., 2004, "Characterization of Airflow Impedance in Two Types of Telecommunications Chassis," Proceedings of the 20th Semi-Therm International Conference, San Jose, CA.. pdf
DeJong Okamoto, N.C., and Hsu, T-R, 2004, "Development of a Laboratory Curriculum Devoted to the Thermal Management of Electronics," Proceedings of the ASEE Annual Conference, Salt Lake City. Invited Presentation. pdf
Rhee, J., Danek, C.J., and Moffat, R.J., 1993 “The Adiabatic Heat Transfer Coefficient on the Faces of a Cube in an Electronics Cooling Situation,” Proceedings of the 1993 International Electronics Packaging Conference, Binghampton, NY
In addition to basic courses in thermodynamics, heat transfer, and fluid dynamics, the Mechanical and Aerospace Engineering Department offers the electives "Thermal Management of Electronics" and "Electronics Packaging"
The National Science Foundation has sponsored the development of this elective and associated lab relating to the thermal management of electronics. The website for this course includes handouts for lab experiments as well as Powerpoint lectures, which anyone may use. For additional information about any experiment, please contact Dr. Okamoto. If you teach a course on this topic, we would love to post a link to your course webpage.
Depending on semester, this course is taught either by Nicole Okamoto or else Cullen Bash and Chandrakant Patel of Hewlett Packard.
Class topics include:
ME 145 Electronics Packaging
This course provides an introduction to the fundamental principles of electronic packaging, materials, thermal management, shock and vibrations, EMI/RFI/ESD, fatique, reliability, and standardized test procedures. Simple design to insure product rules and guidelines are presented.
This course is taught by Fred Barez, chair of the MAE Department.
Department of Mechanical & Aerospace
Development of this laboratory has been sponsored by the Department of Mechanical and Aerospace Engineering at San Jose State University and the National Science Foundation (through Grant Number 0311713).Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
This website is maintained by Nicole Okamoto.