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Electronics Cooling Laboratory |
Mechanical and Aerospace Engineering Department
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at San Jose State University |
Charles W. Davidson
College of Engineering |
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The electronics cooling laboratory at SJSU has two primary goals:
- serving the engineering community
by performing applied research for both local and national organizations
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fostering students' understanding of the thermal management
of electronics.
The joint directors of this lab are Dr. Nicole Okamoto and Dr. Jinny Rhee. Please contact either of them if you would like to discuss sponsorship of a project.
Recent project partners include Hewlett Packard, Cisco Systems, Apple Computer, Therma, Inc., Lockheed Martin, and the National Science Foundation.
Experimental Facilities Computer Modeling Tools Publications Recent Projects Coursework
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Numerical simulation of ducted pin fin heat sink © 2006 Melanie Beauchemin
Our current expertise includes
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numerical modeling of electronic systems requiring thermal management |
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experimental testing of electronic components and systems cooled using single-phase convection (both air and liquid) |
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cooling of high heat density electronics |
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cooling at high elevations |
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design and testing of advanced thermal interface materials |
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micro heat pipes |
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microchannel heat transfer |
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modeling of data centers |
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heat exchanger design and testing |
| Approximately 1200 square foot laboratory |
| High altitude thermal testing chamber, capable of simulating altitudes of up to 80,000 ft and temperatures from ambient to 160şC, from Thermal Product Solutions |
| AMCA 210-99 Airflow Test Chamber from Airflow Measurement Systems; used to measure chassis impedance, generate specified flow rates, and determine fan performance (shown below) |
| Small airflow test chamber for analyzing component-level performance, such as heat sinks. |
| Low-speed (0-2 m/s), low-turbulence intensity wind tunnel; used for a variety of heat transfer experiments |
| National Instruments automated data acquisition system |
| Agilent automated data acquisition system |
| Infrared camera |
| Liquid crystal thermography system |
| Site license for the data acquisition program LabView |
| A wide variety of standard laboratory equipment such as handheld thermocouple readers, a high-precision electronic manometer (Microtector), and pressure transducers |
| Academic site license for the electronics cooling commercial CFD package Flotherm with high-speed computers |
| Academic site license for Pro-E, for 3-D solid modelling, and Pro-Mechanica, for finite element analysis |
| Academic site license for Engineering Equation Solver (EES), a simultaneous equation solver with thermophysical properties built in that is good for thermal system analysis |
AMCA 210-99 Airflow Test Chamber Low-Speed Wind Tunnel
Airflow Test Chamber for Component-Level Testing
High Altitude Chamber
Flow visualization of offset-strip fin array © 1997 Nicole Okamoto
Shown below are recent publications by the lab directors Drs. Rhee and Okamoto (DeJong) with their students and colleagues related to the work of the laboratory.
Journal Publications Related to the Cooling of Electronics
Okamoto, N.C., Hsu, T-R, and Bash, C., 2008, "A Thermal Management of Electronics Course and Laboratory for Undergraduates," accepted for publication in Advances in Engineering Education.
Rhee, J., and Bhatt, A., 2007, “Spatial and Temporal Resolution of Conjugate Conduction-Convection Thermal Resistance,” IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, pp. 673-682
Rhee, J., and Hernandez, S.I., 2006, “Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards,” ASME J. Electronics Packaging, Vol. 128, No. 4, pp. 484-493.
Rhee, J., and Moffat, R.J., 2006, "Experimental Estimate of the Continuous One-Dimensional Kernel Function in a Rectangular Duct With Forced Convection, Journal Heat Transfer, Vol. 128, No. 8, pp. 811-818.
DeJong, N.C., and A.M. Jacobi, 2003, “Heat Transfer and Pressure Drop for Flow through Bounded Louvered-Fin Arrays,” Experimental Thermal and Fluid Science, Vol. 27, pp. 237-250.
DeJong, N.C., and A.M. Jacobi, 2003, “Localized Flow and Heat Transfer Interactions in Louvered-Fin Arrays,” International Journal of Heat and Mass Transfer, Vol. 46, pp. 443-455.
Rhee, J., and Azar, K., 1999, “Adjusting Temperature Data for High Altitude” Electronics Cooling Magazine, September, Vol. 5, No. 3. Online version.
DeJong, N.C., and A.M. Jacobi, 1999, “Local Flow Structures and Heat Transfer in Convex-Louver Fin Arrays,” Journal of Heat Transfer, Vol. 121, pp. 136-141.
DeJong, N.C., L.W. Zhang, A.M. Jacobi, S. Balachandar, and D.K. Tafti, 1998, “A Complementary Experimental and Numerical Study of the Flow and Heat Transfer in Offset Strip-Fin Heat Exchangers,” Journal of Heat Transfer, Vol. 120, pp. 690-698.
DeJong, N.C., and A.M. Jacobi, 1997, “An Experimental Study of Flow and Heat Transfer in Parallel-Plate Arrays: Local, Row-by-Row and Surface Average Behavior,” International Journal of Heat and Mass Transfer, Vol. 40, pp.1365-1378.
DeJong, N.C., M.C. Gentry, and A.M. Jacobi, 1997, “An Entropy-Based, Air-Side Heat Exchanger Performance Evaluation Method: Application to a Condenser,” International Journal of HVAC&R Research, Vol. 3(3), pp. 185-195.
Conference Proceedings Related to the Cooling of Electronics
Bhave, N., and Okamoto, N.C., 2007, "Modeling Noncoplanarity Effects on Thermal Performance of Computer Chips," IEEE Advanced Packaging Materials Symposium, San Jose, CA, Oct. 3-5.
Rogacs, A., and Rhee, J., 2007, "Performance – Cost Optimization of a Diamond Heat Spreader,” Proceedings of 2007 IEEE CPMT Division, Advanced Packaging Materials Conference, San Jose, CA, Oct. 3-5
Beauchemin, M., and Rhee, J., 2006, “Investigation of
Cylindrical Pin Fin Heat Sinks at High Altitude,” Proceedings of the ASME Congress and Exposition, Chicago, IL, Nov.
5-10.
Seidel, R., and Rhee, J., 2006, “Parametric Analysis of Heat Sink Performance at
High Altitudes with Air Impingement Cooling,” Proceedings of the ASME Congress and Exposition, Chicago, IL, Nov.
5-10.
Rhee, J., 2006, "The Role of Temperature Superposition in Thermal
Management," Proceedings of the 11th IEEE CPMT Advanced Packaging Materials
Conference, Atlanta, GA
Bhatt, A., and Rhee, J., 2006, "Thermal Spreading Resistance for Square and
Rectangular Entities," Proceedings of the 11th IEEE CPMT Advanced Packaging
Materials Conference, Atlanta, GA
Heresztyn, A.J.H., and DeJong Okamoto, N.C., 2005, "Thermal Design of Microchannel Heat Sinks for Low-Orbit Micro-Satellites," Proceedings of the 3rd International Conference on Microchannels and Minichannels, American Society of Mechanical Engineers, Toronto.
Rhee, J., and Wong, G., 2004, "Characterization of Airflow Impedance in Two Types of Telecommunications Chassis," Proceedings of the 20th Semi-Therm International Conference, San Jose, CA.. pdf
DeJong Okamoto, N.C., and Hsu, T-R, 2004, "Development of a Laboratory Curriculum Devoted to the Thermal Management of Electronics," Proceedings of the ASEE Annual Conference, Salt Lake City. Invited Presentation. pdf
Rhee, J., Danek, C.J., and Moffat, R.J., 1993 “The Adiabatic Heat Transfer Coefficient on the Faces of a Cube in an Electronics Cooling Situation,” Proceedings of the 1993 International Electronics Packaging Conference, Binghampton, NY
Top and side view of board level packaging © 2002 Sergio Hernandez
Cooling of high-heat flux electronics using liquid: Student design project from
ME 146
In addition to basic courses in thermodynamics, heat transfer, and fluid dynamics, the Mechanical and Aerospace Engineering Department offers the electives "Thermal Management of Electronics" and "Electronics Packaging"
ME 146 Thermal Management of Electronics
The National Science Foundation has sponsored the development of this elective and associated lab relating to the thermal management of electronics. The website for this course includes handouts for lab experiments as well as Powerpoint lectures, which anyone may use. For additional information about any experiment, please contact Dr. Okamoto. If you teach a course on this topic, we would love to post a link to your course webpage.
Depending on semester, this course is taught either by Nicole Okamoto or else Cullen Bash and Chandrakant Patel of Hewlett Packard.
Class topics include:
| Sources of heat generation in electronics | Thermal resistance method |
| Pressure drop calculations | Fans and heat sinks |
| Constriction and spreading resistance | Thermal interface materials |
| Thermal stress analysis | Air cooling of electronics |
| Liquid cooling of electronics | Computational fluid dynamics |
| Jedec Standards | Cooling of data centers |
| Heat Pipes | Thermo-electric cooling |
| Vapor compression systems | RoHS (restriction of hazardous substances) |
| Nano-scale heat transfer | Temperature measurement methods |
ME 145 Electronics Packaging
This course provides an introduction to the fundamental principles of electronic packaging, materials, thermal management, shock and vibrations, EMI/RFI/ESD, fatique, reliability, and standardized test procedures. Simple design to insure product rules and guidelines are presented.
This course is taught by Fred Barez, chair of the MAE Department.
Contact Information
Nicole Okamoto Jinny Rhee
voice: 408-924-4054 voice: 408-924-3876
fax: 408-924-3995 fax: 408-924-3995
email: Nicole.Okamoto at sjsu.edu email: jrhee at email.sjsu.edu
web: www.engr.sjsu.edu/ndejong web: www.engr.sjsu.edu/jrhee
Department of Mechanical & Aerospace
Engineering
San José State University
One Washington Square
San José, California 95192-0087
Development of this laboratory has been sponsored by the Department of Mechanical and Aerospace Engineering at San Jose State University and the National Science Foundation (through Grant Number 0311713).Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.